Project 9: Multiscale analysis of thin films used in MEMS devices
Adviser(s): Philippe Geubelle, Professor in Aerospace Engineering and Fernando Stump, PhD student in Theoretical and Applied Mechanics
Project description: This project aims at developing, implementing and applying advanced multiscale numerical schemes to simulate the damage response of thin films made of gold used in Micro-Electro-Mechanical Systems (MEMS). Of special interest is the modeling of the creep response of these thin films, for which the granular microstructure plays an important role as
grains tend to slide relatively to each other.
As illustrated in Figure 1, the numerical tool involves the discretization of the granular microstructure, the use of a multiscale nonlinear finite element solver able to relate the intergranular damage taking place in the microstructure to the macroscopic creep response of the material. In this particular REU project, the student will work closely with F. Stump to further develop the multiscale solver and perform a set of multiscale simulations under a variety of monotonic and cyclic loading histories
Student background and expected research activities: A good background in solid mechanics (concept of stresses, strains, equilibrium, …) is required to understand the physics of the simulated damage response. Furthermore, this project will involve both the use of a multiscale finite element code developed in-house and some additional code development. A good background in programming and a good familiarity with computers (and especially with the UNIX/LINUX operating system) are thus desirable.
Fig. 1. Multiscale finite element analysis of the creep response of a granular material used in MEMS application.
Point(s) of contact:
Philippe H. Geubelle – geubelle@uiuc.edu
Fernando Stump - fstump2@uiuc.edu
